|1930 - meetup|
|2000 TalkNight 1800 Máme otevřeno 2016|
This is an old revision of the document!
For IC analysis, you first need to expose the die. This process is called decapsulation. Silicon pr0n wiki has an extensive overview of methods. Methods that do not require lots of expensive equipment and we should try are:
Stripping individual layers of die to study underlying ones.