|1930 - meetup 1630 visit from hub:raum|
|1900 AS400, MainFrame, Cobol|
This is an old revision of the document!
For IC analysis, you first need to expose the die. This process is called decapsulation. Silicon pr0n wiki has an extensive overview of methods. Methods that do not require lots of expensive equipment and we should try are:
Stripping individual layers of die to study underlying ones.