Reverseingeneering Vaisala weather sonde PCB, creating schematics.
The following pictures capture all 4 PCB copper layers and component placement.
TODO:
main PCB back side top layer
![main PCB back side top layer main PCB back side top layer](https://brmlab.cz/_media/project/weathersonde/imgp8648.jpg?w=400&tok=5fc613)
main PCB front side top layer
![main PCB front side top layer main PCB front side top layer](https://brmlab.cz/_media/project/weathersonde/imgp8650.jpg?w=400&tok=865253)
sensors PCB front side
![sensors PCB front side sensors PCB front side](https://brmlab.cz/_media/project/weathersonde/imgp8651.jpg?w=400&tok=03a60d)
sensors PCB back side
![sensors PCB back side sensors PCB back side](https://brmlab.cz/_media/project/weathersonde/imgp8653.jpg?w=400&tok=f0aebb)
main PCB front side top layer - with removed curcuits
![main PCB front side top layer - with removed curcuits main PCB front side top layer - with removed curcuits](https://brmlab.cz/_media/project/weathersonde/imgp8673.jpg?w=400&tok=96bbd4)
main PCB xxx side bottom layer
![main PCB xxx side bottom layer main PCB xxx side bottom layer](https://brmlab.cz/_media/project/weathersonde/imgp8679.jpg?w=400&tok=e68af3)