chip reverse engineering
pprohd.jpg
founder: biiter
depends on:
interested: biiter
nephirus
ruza
kxt
software license: -
hardware license: -
status: dead

Chip reverse engineering

TODO

  • get some basic laboratory equipment - glassware (beakers, watch glass, Petri dishes, storage vials, wash bottles), hotplate
  • get basic chemicals - concentrated sulphuric acid, fuming nitric acid
  • build a fume hood
  • buy a microscope
  • build a probing station (rigid table with micromanipulators and stereo microscope, like this) for live analysis

Microscope candidates

Workflow

Decapsulation

For IC analysis, you first need to expose the die. This process is called decapsulation. Silicon pr0n wiki has an extensive overview of methods. Methods that do not require lots of expensive equipment and we should try are:

Delayering

Stripping individual layers of die to study underlying ones.

FIXME

Analysis

FIXME

References

Recommended stuff

 
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